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Dimensional Specifications for C10100 Copper Wire
C10100 copper wire is available in a wide range of diameters to suit diverse industrial requirements. The typical dimensional ranges include:
- Diameter:
- Ultra-fine wire: 0.03 mm (30 µm) to 2.6 mm (common for precision electronics and silver-plated applications) .
- Standard wire: 0.05 mm (50 µm) to 4.5 mm (general-purpose electrical and thermal applications) .
- Heavy-duty profiles: Up to 4.5 mm for high-current busbars or industrial power distribution systems .
Custom diameters outside these ranges can be produced based on specific requirements, though standard sizes prioritize consistency in conductivity and mechanical performance.
International Standards for C10100 Copper Wire
C10100 copper wire complies with globally recognized standards to ensure uniformity in quality and performance:
- ASTM (U.S.):
- ASTM B170: Specifies requirements for oxygen-free copper shapes (wire, rod, bar).
- ASTM F68: Covers electronic device applications, emphasizing oxygen-free properties .
- EN/EU:
- EN CW009A: Equivalent to C10100, defining oxygen-free copper for electrical uses .
- JIS (Japan):
- JIS C1011: Standard for high-purity oxygen-free copper wire and rods .
- ISO:
- ISO Cu-OF: Oxygen-free copper for electronic and vacuum applications .
- Other Equivalents:
- BS C101 (UK), DIN CW009A (Germany), GB/T 14594 (China for vacuum devices) .
These standards govern chemical composition, mechanical properties (e.g., tensile strength: 200–360 MPa, elongation: 15–50%), and dimensional tolerances, ensuring compatibility with global engineering requirements .
The chemical composition of C10100 oxygen-free copper varies slightly in different standards:
Core ingredients
Copper (Cu): ≥99.99% (most standards), some standards are ≥99.97% (Cu+Ag) or >99.95%.
Oxygen (O): usually ≤0.001% (10ppm), but some standards are relaxed to ≤0.03% or ≤0.002%.
Impurity elements (maximum content)
Lead (Pb): ≤0.001% (common), occasionally ≤0.003%.
Sulfur (S): ≤0.0018% or ≤0.004%.
Phosphorus (P): ≤0.0003% or ≤0.002%.
Zinc (Zn): ≤0.0001% or ≤0.003%.
Other elements (such as Ca, Hg, Se, Te, Bi, As, etc.): all ≤0.0001%~0.002%.
C10100 is a high-purity oxygen-free copper (OFHC) whose mechanical properties vary significantly depending on the material state (such as annealing, cold working, etc.).
1. Tensile strength and yield strength
Annealed state (O state): tensile strength ranges from 200-235 MPa, and yield strength ≥80 MPa.
Cold working state: With the increase of cold working degree, the strength increases significantly:
1/2 hard state (1/2H): tensile strength ≥250 MPa, yield strength ≥350 MPa.
Full hard state (H): tensile strength can reach 300-455 MPa, and yield strength can reach up to 400 MPa.
Extreme cold working (such as EH state): tensile strength can be further increased to 550 MPa (other alloy states may refer to similar trends).
2. Elongation
Annealed state: the elongation is the highest, up to 35%-55%.
After cold working: the elongation drops significantly, such as ≥15% in 1/2H state and ≥2% in full hard state (H). Some data mention that the minimum elongation is ≥8%, which may correspond to a medium degree of cold working.
3. Hardness
Vickers hardness (HV): annealed state is about 75-90 HV, full hard state (H) can reach 90-120 HV.
Rockwell hardness: Rockwell F hardness is 40-100, Rockwell 30T hardness is 27-70.
4. Elasticity and shear properties
Elastic modulus: tensile modulus is 115 GPa, shear modulus is 44 GPa.
Poisson's ratio: 0.31-0.34.
5. Other mechanical properties
Shear strength: 150-240 MPa.
Fatigue strength and impact toughness: After cold hardening, the impact strength is improved, but the specific values need to refer to experimental data.
Creep resistance: High-purity oxygen-free copper shows good creep resistance.
6. Effect of state on performance
Annealing treatment (500-700°C): restore ductility and reduce strength.
Cold working (such as rolling, drawing): significantly improve strength, but sacrifice ductility.
Recrystallization temperature: The recrystallization starting temperature after cold hardening is 200-300°C.
Processing performance:
Supports rolling, drawing, forging, deep drawing and complex forming (such as waveguides, cavity resonators).
Good weldability, can use a variety of welding techniques, and no risk of hydrogen embrittlement
Production process and product advantages of C10100 copper wire:
Production process
Raw material refining
C10100 copper uses high-purity oxygen-free electronic copper (OFE copper) with a purity of more than 99.99%. During the production process, impurities and slag must be removed by bottom blowing inert gas (such as N₂, CO) to ensure that the oxygen content is ≤0.0005%. This refining technology can effectively control the grain size and purity and avoid "hydrogen disease" (hydrogen embrittlement in a high-temperature reducing atmosphere).
Wire drawing process
Rough drawing and surface treatment: Copper wire production starts with rough drawing and wire laying, and undergoes pretreatment steps such as mechanical shelling, electrolytic pickling (removal of oxides), cold water/hot water washing, and then borax is coated for lubrication and oxidation prevention.
Cold drawing: Using the cold drawing process (annealing may be required in the middle), the diameter of the copper wire is gradually refined through a water tank wire drawing machine. Cold processing can significantly improve the tensile strength (the strength after cold processing can reach 4 times that of the annealed state) while maintaining stable conductivity.
Plating and post-processing: Some processes require lead plating (such as lead pool immersion and drying), followed by twisting, rope closing and other steps, and finally inspection and packaging.
Processing skills
Use sharp carbide tools, control cutting speed and feed rate to avoid work hardening.
Use coolant to cool down, down milling to reduce burrs, and regularly check the dimensional accuracy of the workpiece.
Product advantages
Excellent electrical and thermal conductivity
Electrical conductivity ≥101% IACS, thermal conductivity 10100 W/m·K, suitable for circuit boards, cables, radiators and other fields with strict electrical performance requirements.
Excellent processing performance
Excellent cold and hot processing performance, can be drawn into filaments or processed into complex shapes (such as electrodes, waveguides).
High ductility (elongation ≥45%), good welding and brazing performance, suitable for precision electronic component manufacturing.
High strength and durability
The tensile strength is significantly improved after cold processing (e.g., the cold rolled state can reach 340 MPa), and the fatigue strength is 33% higher than that of annealed copper, which is suitable for high cycle load scenarios.
Strong corrosion resistance, suitable for chemical equipment, marine environment, etc.
Surface quality and consistency
The surface finish after processing is high (such as mirror, polished treatment), without pores or black skin, ensuring discharge stability and production accuracy.
Wide application
It covers high-end fields such as electronic connectors, power cables, vacuum sealing parts, and nuclear heat exchanger welding parts.
Q1:Do you provide samples? Is it free or extra?
A1:Yes, we can provide samples free of charge and the customer will pay the freight.
Q2:What if I don't have export experience ?
A2:We have reliable forwarder agent which can ship items to you by sea/air/Express to your doorstep. Any way, we will help you choose the most suitable shipping service.
Q3:How long is your lead time?
A3:If it is in stock, it is usually 5-10 days. Or, if there is no inventory, 15 days, depending on the quantity.
Q4:What are your terms of payment?
A4:30% T/T deposit in advance, 70% T/T balance within 5 days after B/L copy, 100%.Irrevocable L/C at sight, 100% Irrevocable L/C after receive B/L 30-120 days, O/A.
Q5:How is your technical support?
A5:We provide lifetime online support through Whatsapp/ Skype/ Wechat/ Email. Any problem after delivery, we will offer you call anytime.
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