W70Cu3/WCu70 (tungsten copper alloy)

Production process

Infiltration method:

High temperature sintering of tungsten skeleton (1800-2200℃) followed by copper infiltration (1300-1400℃), density > 99.2%; or partial mixed powder (2-6% Cu + additives such as Ni) sintering followed by infiltration, suitable for alloys with φCu > 20%.

Direct sintering method:

Mixed oxides (such as WO₃ and Cu₂O) co-reduction sintering, φCu > 25%, density nearly 99%;

Liquid phase sintering (adding Ni/Co/Fe, etc.) to increase density, φCu > 20%;

Mechanical alloying nanopowder method: high energy ball milling to prepare nanopowder, low temperature sintering to achieve > 99% density, suitable for alloys with φCu > 20%.

Vacuum infiltration process: It is mentioned that this process is used to manufacture WCu70 tungsten copper tubes, combining static pressing and high temperature sintering of high purity tungsten powder and copper powder to ensure material uniformity and high density.

Product advantages

High melting point and high temperature resistance: The melting point of tungsten is 3410℃, and that of copper is 1083℃. The alloy has high temperature stability and is suitable for high-voltage switches, spark electrodes, etc.

High electrical conductivity/thermal conductivity: The excellent electrical conductivity of copper combined with the arc erosion resistance of tungsten is suitable for microelectronic heat dissipation and conductive components.

Low thermal expansion coefficient: It can be matched with ceramics and semiconductor materials by adjusting the tungsten content, and can be used in precision fields such as LED heat dissipation substrates.

High density and wear resistance: The density reaches 12-17g/cm³, and the wear resistance is excellent, which is suitable for molds and high-temperature military components.