Production process and product advantages of C26800 copper wire:

Production process

Raw material pretreatment:

C26800 copper wire uses electrolytic copper plate as raw material. It is first preheated in a copper plate drying furnace (temperature 80~150℃) to remove surface moisture. This process may produce natural gas combustion exhaust gas. The copper plate is then formed into wire billets through processes such as smelting and rolling.

Cold processing and forming:

C26800 brass has excellent cold processing capabilities and can be made into copper wire or copper wire through processes such as cold drawing, cold rolling, and cold drawing. For example, the processing of cold drawn wire requires steps such as wire laying, bundle twisting, and stretching to finally form copper wire of the required specifications. Some wires also need to be twisted, and multiple strands of copper wire are twisted into finished products through a wire bundler.

Surface treatment (optional):

For copper wires that need to be tinned (such as electronic wires), hot tinning process is required. The process includes: wiping flux after the copper wire is divided, entering the tinning equipment to form a tin layer protection, and finally winding and testing. This process may produce tin slag and waste gas, which need to be treated in an environmentally friendly manner.

Annealing and quality control:

The annealing temperature is usually 540~600℃, which can improve the toughness of the material and reduce the risk of stress corrosion. The finished product must pass strength tests, hardness tests and other tests to ensure compliance with standards such as ASTM B36.

Product advantages

Excellent mechanical properties:

The tensile strength of C26800 copper wire is ≥440MPa, and the elongation is ≥25%~30%. It has both high strength and good ductility and is suitable for complex forming. Its cold processing ability is better than hot processing, and it is especially suitable for precision wire manufacturing.

Corrosion resistance and dezincification resistance:

Good corrosion resistance in conventional environments, but it should be noted that stress corrosion cracking may occur in ammonia, mercury or acidic media. The ability to resist dezincification can be significantly improved through annealing and composition control (such as zinc content ≤33%).

Electrical and thermal conductivity:

The electrical conductivity is 28% IACS (in soft state), which is an ideal material for electronic components, radiators, and motor windings, especially widely used in copper wires for new energy vehicle motors.

Wide processing adaptability:

It supports a variety of processing methods, including stamping, welding, deep drawing, etc., and is suitable for manufacturing precision parts such as radiator housings, bellows, and semiconductor bonding wires. For example, palladium-plated bonding copper wires are gradually replacing gold wires in semiconductor packaging due to their low cost and excellent conductivity.

Cost and market advantages:

Compared with pure copper or gold wires, C26800 copper wires have lower costs and have formed standardized production (such as ASTM B36), occupying nearly 29% of the market share in the fields of power, ships, automobiles, and semiconductors.